Aluminum Heat Sink Heatsink Module Cooler Fin for High Power Amplifier Transistor Semiconductor Devices

100% Brand New High Quality
Material: Aluminum
Fins: 19
Size: 11.8″(L) x 5.51″(W) x 0.79″(H) / 300 mm (L) x 140 mm (W) x 20 mm (H)
Quantity: 1
Weight: 157g (approx.)

Dense 19 pcs Fins 11.8″(L) x 5.51″(W) x 0.79″(H) / 300 mm (L) x 140 mm (W) x 20 mm (H)

  • Made of high-quality Aluminum, good thermal conductivity
  • Reduce the risk of hardware failure due to overheating
  • Maximize surface area Designed in contact with the cooling air. The 19 pcs fins increase the area of the board and thus provide for greater heat transfer

 

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